ディテール
数量（個）:1
最小注文数量:1
リードタイム:3~6 months
配送方法:陆运, 海运
規格番号:LKJB300
製品ディテール
Advantages:
1. Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
2. Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
3. Meets SECS/GEM requirements