Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
FOB
最小注文数量:
1
配送方法:
陆运, 海运
数量(個):
1
製品情報
ディテール
数量(個):1
最小注文数量:1
リードタイム:3~6 months
配送方法:陆运, 海运
規格番号:LKDJ200
製品ディテール
Advantages:
1.       Flexible
l  Can process 4-6-8 inches various material wafer
l  Can easily switch to process different size of wafer
l  Process know-how can be set in the software system according to client's process requirements
2.       High-precision
Self-developed spindle precision is up to 1um
3.       High reliability
Non-contact centering and measuring approach ensure the stable alignment