Wafer Lapping Powder
Wafer Lapping Powder
Wafer Lapping Powder
FOB
最小注文数量:
1
配送方法:
快递, 空运, 陆运, 海运
数量(個):
1
サンプル:無料サポートサンプルを取得する
製品情報
ディテール
数量(個):1
最小注文数量:1
リードタイム:1~3 weeks
配送方法:快递, 空运, 陆运, 海运
製品ディテール
Overview:
This series of alumina or boron carbide composite precision grinding materials are produced with strict control over particle morphology and material hardness. Through rigorous quality management, the products consistently deliver stable grinding and polishing efficiency along with exceptional surface quality. They exhibit outstanding processing performance on materials such as semiconductors, crystals, lenses, prisms, silicon carbide and sapphire etc..