ディテール
数量（個）:1
最小注文数量:1
リードタイム:1~3 weeks
配送方法:快递, 空运, 陆运, 海运
製品ディテール
Applications:
Mainly used for edge grinding of semiconductor wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, germanium, sapphire and ultra-thin liquid crystal glass.
Advantages:
1. Offers both metal bond and resin bond types
2. Can accurately match to meet the ultra-precision and ultra-high surface quality requirements