Overview:

This equipment is primarily designed for slicing and cutting hard and brittle materials, as well as composite materials, offering a wide range of material processing capabilities. It is suitable for cutting materials such as quartz glass, monocrystalline silicon, polycrystalline silicon, alumina, aluminum foam, ceramics, jadeite, jade, rock mineral specimens, artificial KTP crystals, ceramic target materials, semiconductor packaging materials, tire composites, magnetic materials, stone and more.

Advantages:

1. Flexible cutting: capable of cutting off, slicing, and contouring 2D profiles.
2. Automatic cutting: enables one operator to manage multiple units simultaneously, reducing labor requirements and saving workforce costs.
3. High efficiency: delivers exceptional cutting speed, significantly improving processing productivity. This equipment more than doubles the processing efficiency compared to conventional methods.
4. Material savings: utilizes fine-diameter wires with narrow kerfs, minimizing material waste and optimizing resource utilization. This equipment reduces material waste by over 30%.
5. Customization available as per customer request.