Необходимые детали
Количество (штук):1
MOQ:1
Время выполнения заказа:3~6 months
Доставка:陆运, 海运
номер спецификации:LKJB300
Введение в продукт
Advantages:
- Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
- Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
- Meets SECS/GEM requirements