Wafer Surface Grinding Machine for Silicon
Wafer Surface Grinding Machine for Silicon
Wafer Surface Grinding Machine for Silicon
FOB
MOQ:
1
Shipping:
Land freight, Ocean freight
Quantity(pieces):
1
Product details
Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land freight, Ocean freight
Specification Number:LKJB300
Product Introduction
Advantages:
1.       Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
2.       Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
3.       Meets SECS/GEM requirements