Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land transportation, sea transportation
Specification Number:LKJB300
Product Introduction
Advantages:
- Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
- Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
- Meets SECS/GEM requirements