Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land freight, Ocean freight
Specification Number:LKJB200
Product Introduction
Advantages:
1. Maximum grinding speed 0.9 μm/s to achieve within 5 minutes per wafer
2. Adopts online measuring instrument to control grinding thickness precisely
3. Meets SECS/GEM requirements
4. Optional SMIF function to keep wafers clean in process