Essential details
Quantity(pieces):1
MOQ:1
Lead time:1~3 weeks
Shipping:Express Delivery, Air freight, Land freight, Ocean freight
Product Introduction
Applications:
Mainly used for grinding and thinning of semiconductor material substrates and wafers such as silicon, silicon carbide, gallium arsenide, indium phosphide, sapphire, etc.
Advantages:
1. Can provide vitrified bond, resin bond and metal bond types
2. Can replace imported products thru excellent grinding surface quality and high cost performance
3. Can provide suitable overall solutions such as grinding wheels and grinding processes, which can meet the needs of the diversified development of different semiconductor materials and processing grinding machines