Essential details
Quantity(pieces):1
MOQ:1
Lead time:1~3 weeks
Shipping:Express Delivery, Air freight, Land freight, Ocean freight
Product Introduction
Applications:
Mainly used for edge grinding of semiconductor wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, germanium, sapphire and ultra-thin liquid crystal glass.
Advantages:
1. Offers both metal bond and resin bond types
2. Can accurately match to meet the ultra-precision and ultra-high surface quality requirements