Wafer Defect Inspection Equipment
Wafer Defect Inspection Equipment
Wafer Defect Inspection Equipment
FOB
MOQ:
1
Shipping:
Land transportation, sea transportation
Quantity(pieces):
1
Product details
Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land transportation, sea transportation
Product Introduction
Overview:

Inspection of common defects in product line:

1. After Develop Inspection
2. After Etch Inspection
3. Post CMP Inspection
4. Fab Outgoing QA

Advantages:

1. High efficiency: The high-speed synchronous motion control technology are adopted to meet the requirements of high-efficiency inspection of IC products in all areas.
2. High detection rate: Feature-based machine learning algorithms are adopted to effectively identify subtle defects and enhance defect inspection rate.
3. Intelligence: Prescription auxiliary editing function are available, personnel efficiency and be greatly improved and new product introduction cycle can be greatly shortened.
4. Comprehensiveness: The automatic inspection of each process of IC is available, audit has good material compatibility.
5. Factory automation: It supports SECS/GEM SEMI standard, which can fully meet the requirements of factory automation.