Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land transportation, sea transportation
Specification Number:LKJB200
Product Introduction
Advantages:
- Maximum grinding speed 0.9 μm/s to achieve within 5 minutes per wafer
- Adopts online measuring instrument to control grinding thickness precisely
- Meets SECS/GEM requirements
- Optional SMIF function to keep wafers clean in process