Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land transportation, maritime transportation
Specification Number:LKQX300G
Product Introduction
Overview:
1. Wafer Size:8–12 inches
2. Capacity:13 / 25 pcs per run
3. Process:FOUP → EFM → Glue Removal → IPA → QDR → QDR → Drying → EFM → FOUP
4. Convey Approach:Mechanical Arm
5. Tact Time:5–10 minutes (adjustable)
6. Glue Removal Rate:≥ 99%
7. Customization:Manual / Semi-automatic
2. Capacity:13 / 25 pcs per run
3. Process:FOUP → EFM → Glue Removal → IPA → QDR → QDR → Drying → EFM → FOUP
4. Convey Approach:Mechanical Arm
5. Tact Time:5–10 minutes (adjustable)
6. Glue Removal Rate:≥ 99%
7. Customization:Manual / Semi-automatic