Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
FOB
MOQ:
1
Shipping:
Land transportation, sea transportation
Quantity(pieces):
1
Product details
Essential details
Quantity(pieces):1
MOQ:1
Lead time:3~6 months
Shipping:Land transportation, sea transportation
Specification Number:LKDJ200/LKDJ300
Product Introduction
Advantages:
1. Flexible
  • LKDJ200 can process 4, 6, and 8-inch wafers of various materials
  • LKDJ200 can easily switch to process different size wafers
  • Process know-how can be set in the software system according to client's process requirements
2. High-precision
Self-developed spindle precision is up to 1um
3. High reliability
Non-contact centering and measuring approach ensure stable alignment