Wafer Surface Grinding Machine for Silicon
Wafer Surface Grinding Machine for Silicon
Wafer Surface Grinding Machine for Silicon
FOB
최소 주문 수량:
1
배송 방법:
陆运, 海运
수량(개):
1
제품 세부정보
필수 정보
수량(개):1
최소 주문 수량:1
납기일:3~6 months
배송 방법:陆运, 海运
규격 번호:LKJB300
제품 소개
Advantages:
1.       Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
2.       Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
3.       Meets SECS/GEM requirements