필수 정보
수량(개):1
최소 주문 수량:1
납기일:3~6 months
배송 방법:陆运, 海运
규격 번호:LKJB200
제품 소개
Advantages:
1. Maximum grinding speed 0.9 μm/s to achieve within 5 minutes per wafer
2. Adopts online measuring instrument to control grinding thickness precisely
3. Meets SECS/GEM requirements
4. Optional SMIF function to keep wafers clean in process