Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
FOB
최소 주문 수량:
1
배송 방법:
陆运, 海运
수량(개):
1
제품 세부정보
필수 정보
수량(개):1
최소 주문 수량:1
납기일:3~6 months
배송 방법:陆运, 海运
규격 번호:LKDJ200
제품 소개
Advantages:
1.       Flexible
l  Can process 4-6-8 inches various material wafer
l  Can easily switch to process different size of wafer
l  Process know-how can be set in the software system according to client's process requirements
2.       High-precision
Self-developed spindle precision is up to 1um
3.       High reliability
Non-contact centering and measuring approach ensure the stable alignment