필수 정보
수량(개):1
최소 주문 수량:1
납기일:1~3 weeks
배송 방법:快递, 空运, 陆运, 海运
제품 소개
Applications:
Mainly used for grinding and thinning of semiconductor material substrates and wafers such as silicon, silicon carbide, gallium arsenide, indium phosphide, sapphire, etc.
Advantages:
1. Can provide vitrified bond, resin bond and metal bond types
2. Can replace imported products thru excellent grinding surface quality and high cost performance
3. Can provide suitable overall solutions such as grinding wheels and grinding processes, which can meet the needs of the diversified development of different semiconductor materials and processing grinding machines