Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
FOB
최소 주문 수량:
1
배송 방법:
陆运, 海运
수량(개):
1
제품 세부정보
필수 정보
수량(개):1
최소 주문 수량:1
납기일:3~6 months
배송 방법:陆运, 海运
규격 번호:LKDJ200/LKDJ300
제품 소개
Advantages:
1. Flexible
  • LKDJ200 can process 4-6-8 inches various material wafer
  • LKDJ200 can easily switch to process different size of wafer
  • Process know-how can be set in the software system according to client's process requirements
2. High-precision
Self-developed spindle precision is up to 1um
3. High reliability
Non-contact centering and measuring approach ensure the stable alignment