Détails essentiels
Quantité (pièces):1
MOQ:1
Délai de livraison:3~6 months
Expédition:陆运, 海运
numéro de spécification:LKBP300
Introduction du produit
Overview:
This equipment is an ultra-precision polishing machine for silicon wafer peripheral edges (notch VN or orientation flat OF), which processes 6/8/12-inch (150/200/300mm) wafers by applying pressure with a polishing cloth to achieve edge polishing.