Wafer Lapping Powder
Wafer Lapping Powder
Wafer Lapping Powder
FOB
MOQ:
1
Expédition:
快递, 空运, 陆运, 海运
Quantité (pièces):
1
Échantillon:Support gratuitObtenir des échantillons
Détails du produit
Détails essentiels
Quantité (pièces):1
MOQ:1
Délai de livraison:1~3 weeks
Expédition:快递, 空运, 陆运, 海运
Introduction du produit
Overview:
This series of alumina or boron carbide composite precision grinding materials are produced with strict control over particle morphology and material hardness. Through rigorous quality management, the products consistently deliver stable grinding and polishing efficiency along with exceptional surface quality. They exhibit outstanding processing performance on materials such as semiconductors, crystals, lenses, prisms, silicon carbide and sapphire etc..