Stealth laser dicing is a cutting technology where an infrared laser beam is focused inside a silicon wafer to form a modified layer for separation via scanning. External force is then applied to the wafer to divide it into individual chips.
Applied for laser modified layer dicing of Si-based wafers such as MEMS sensors, RFID sensors, etc. Applications include: MEMS microphones, MEMS pressure sensors, pressure sensing chips, MEMS temperature sensors, 
temperature measurement chips, MEMS inertial sensors, biochips, gyroscopes, gas sensors, optical communication, etc.

1. Specially designed stealth laser dicing engine tailored for Si-based MEMS characteristics;
2. Excellent control of the dicing street, superior cutting results;
3. High-precision vision system, automatic alignment, automatic focus finding;
4. High-precision motion stage, damage-free dicing;

5. Compatible with 6-inch, 8-inch fully automatic operation (12-inch customizable)