Diamond Wire Crop Saw for Silicon Wafers
Diamond Wire Crop Saw for Silicon Wafers
Diamond Wire Crop Saw for Silicon Wafers
FOB
MOQ:
1
Expédition:
陆运, 海运
Quantité (pièces):
1
Détails du produit
Détails essentiels
Quantité (pièces):1
MOQ:1
Délai de livraison:3~6 months
Expédition:陆运, 海运
numéro de spécification:LKJD33250P
Introduction du produit

Advantages:

1. Ingot is automatically loaded by the gantry robot. Equipped with safety protection fence and light curtains
2. Cutting unit adopts a double-column gantry structure providing stable and reliable operation with low failure rate, high cutting efficiency and precision
3. Blocks are automatically conveyed to the unloading area facilitating unloading and transportation. Optional fully automatic unloading device
4. Loading conveyor and cutting unit are equipped with a wireless remote control handle facilitating left-right and up-down movement for easy replacement of diamond wire and cutting wheel
5. Optional work order scanning and laser marking
6. Optional automatic sampling device