Détails essentiels
Quantité (pièces):1
MOQ:1
Délai de livraison:3~6 months
Expédition:陆运, 海运
numéro de spécification:LKJB300
Introduction du produit
Advantages:
- Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
- Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
- Meets SECS/GEM requirements