Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
FOB
MOQ:
1
Expédition:
陆运, 海运
Quantité (pièces):
1
Détails du produit
Détails essentiels
Quantité (pièces):1
MOQ:1
Délai de livraison:3~6 months
Expédition:陆运, 海运
numéro de spécification:LKDJ200/LKDJ300
Introduction du produit
Advantages:
1. Flexible
  • LKDJ200 can process 4-6-8 inches various material wafer
  • LKDJ200 can easily switch to process different size of wafer
  • Process know-how can be set in the software system according to client's process requirements
2. High-precision
Self-developed spindle precision is up to 1um
3. High reliability
Non-contact centering and measuring approach ensure the stable alignment