Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:3~6 months
Envío:陆运, 海运
número de especificación:LKJB300
Introducción del producto
Advantages:
1. Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
2. Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
3. Meets SECS/GEM requirements