Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:3~6 months
Envío:陆运, 海运
número de especificación:LKBP300
Introducción del producto
Overview:
This equipment is an ultra-precision polishing machine for silicon wafer peripheral edges (notch VN or orientation flat OF), which processes 6/8/12-inch (150/200/300mm) wafers by applying pressure with a polishing cloth to achieve edge polishing.