Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
Wafer Edge Grinding Machine for Silicon Carbide/Sapphire
FOB
MOQ:
1
Envío:
陆运, 海运
Cantidad (piezas):
1
Detalles del producto
Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:3~6 months
Envío:陆运, 海运
número de especificación:LKDJ200
Introducción del producto
Advantages:
1.       Flexible
l  Can process 4-6-8 inches various material wafer
l  Can easily switch to process different size of wafer
l  Process know-how can be set in the software system according to client's process requirements
2.       High-precision
Self-developed spindle precision is up to 1um
3.       High reliability
Non-contact centering and measuring approach ensure the stable alignment