Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:1~3 weeks
Envío:快递, 空运, 陆运, 海运
Introducción del producto
Overview:
This Alumina slurry is designed to meet the specification requirements for silicon carbide and sapphire substrate production polishing. It is specifically formulated for both batch and single-wafer CMP systems. The advanced composition delivers ultra-high removal rates while maintaining exceptional surface planarity, zero sub-surface damage, and low defects with minimal scratching.