This system is primarily comprised of a vacuum transfer platform, a degas chamber, a pre-cleaning chamber, and process chambers. The tool adopts a cluster tool architecture, allowing for the configuration of multiple process chambers, pre-cleaning chambers, and degas chambers. The process chambers can be configured according to customer choices.

This equipment features fully automated operations, including wafer automatic transfer, process degassing, wafer surface pre-cleaning, and thin-film deposition. This product series is widely applied in the 6/8-inch power semiconductor field.