Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:3~6 months
Envío:陆运, 海运
Introducción del producto
Advantages:
1. Multi-size compatibility: 4-8 inch wafer bare dies;
2. Automatic loading/unloading: Robot handler;
3. Automatic aligner: Corrects wafer center and angle;
4. Capable of marking on the product edge;
5. Equipped with automatic wafer mapping function;
6. OCR recognition and inspection (Optional)
7. Can connect to the customer's company system, supports SECS/GEM function;
8. Optional air cleaning system (FFU) and fume collection & filtration system.
2. Automatic loading/unloading: Robot handler;
3. Automatic aligner: Corrects wafer center and angle;
4. Capable of marking on the product edge;
5. Equipped with automatic wafer mapping function;
6. OCR recognition and inspection (Optional)
7. Can connect to the customer's company system, supports SECS/GEM function;
8. Optional air cleaning system (FFU) and fume collection & filtration system.