Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:3~6 months
Envío:陆运, 海运
número de especificación:LKQX300G
Introducción del producto
Overview:
1. Wafer Size: 8–12 inches
2. Capacity: 13 / 25 pcs per run
3. Process: FOUP → EFM → Glue Removal → IPA → QDR → QDR → Drying → EFM → FOUP
4. Convey Approach: Mechanical Arm
5. Tact Time: 5–10 minutes (adjustable)
6. Glue Removal Rate: ≥ 99%
7. Customization: Manual / Semi-automatic
2. Capacity: 13 / 25 pcs per run
3. Process: FOUP → EFM → Glue Removal → IPA → QDR → QDR → Drying → EFM → FOUP
4. Convey Approach: Mechanical Arm
5. Tact Time: 5–10 minutes (adjustable)
6. Glue Removal Rate: ≥ 99%
7. Customization: Manual / Semi-automatic