Detalles esenciales
Cantidad (piezas):1
MOQ:1
Tiempo de entrega:1~3 weeks
Envío:快递, 空运, 陆运, 海运
Introducción del producto
Applications:
Mainly used for edge grinding of semiconductor wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, germanium, sapphire and ultra-thin liquid crystal glass.
Advantages:
1. Offers both metal bond and resin bond types
2. Can accurately match to meet the ultra-precision and ultra-high surface quality requirements