Wesentliche Details
Menge (Stück):1
MOQ:1
Lieferzeit:3~6 months
Versand:陆运, 海运
Spezifikationsnummer:LKJB300
Produkteinführung
Advantages:
- Wafer surface grinding stability highly improved by rough and fine grinding trajectory coincidence technology
- Can work with single-axis polisher and protective film treatment equipment to achieve integration from wafer grinding to stress removal
- Meets SECS/GEM requirements