Wesentliche Details
Menge (Stück):1
MOQ:1
Lieferzeit:3~6 months
Versand:陆运, 海运
Spezifikationsnummer:LKBP300
Produkteinführung
Overview:
This equipment is an ultra-precision polishing machine for silicon wafer peripheral edges (notch VN or orientation flat OF), which processes 6/8/12-inch (150/200/300mm) wafers by applying pressure with a polishing cloth to achieve edge polishing.