Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
Wafer Edge Grinding Machine for Silicon
FOB
MOQ:
1
Versand:
陆运, 海运
Menge (Stück):
1
Produktdetails
Wesentliche Details
Menge (Stück):1
MOQ:1
Lieferzeit:3~6 months
Versand:陆运, 海运
Spezifikationsnummer:LKDJ200/LKDJ300
Produkteinführung
Advantages:
1.       Flexible
l  LKDJ200 can process 4-6-8 inches various material wafer
l  LKDJ200 can easily switch to process different size of wafer
l  Process know-how can be set in the software system according to client's process requirements
2.       High-precision
Self-developed spindle precision is up to 1um
3.       High reliability
Non-contact centering and measuring approach ensure the stable alignment