PECVD Equipment
PECVD Equipment
PECVD Equipment
FOB
MOQ:
1
Versand:
陆运, 海运
Menge (Stück):
1
Produktdetails
Wesentliche Details
Menge (Stück):1
MOQ:1
Lieferzeit:3~6 months
Versand:陆运, 海运
Produkteinführung
Overview:
1. Process application: α-Si,SiO2,SixNy,PSG,BPSG
2. Wafer size: 8 inches and below
3. Applicable substrate material: Silicon, silicon carbide, gallium nitride, gallium arsenide, sapphire, quartz glass
4. Chamber type: Multichip type