Diamond Wire Saw for Silicon Wafers
Diamond Wire Saw for Silicon Wafers
Diamond Wire Saw for Silicon Wafers
FOB
MOQ:
1
Versand:
陆运, 海运
Menge (Stück):
1
Produktdetails
Wesentliche Details
Menge (Stück):1
MOQ:1
Lieferzeit:3~6 months
Versand:陆运, 海运
Spezifikationsnummer:LKQP2060/LKQP3060
Produkteinführung
Advantages:
  1. The tension sensor has a range of 30N for higher control precision
  2. Patented slurry pipe can control main and auxiliary flow rates independently
  3. Low-inertia lightweight integrated pulleys for convenient replacement
  4. Adopts Siemens motion control system and motors
  5. Compatible with automatic ingot stick equipment with a NTC form bottom surface
  6. Front-end loading approach for convenient operation and capable of upgrading to automatic loading
  7. The tension arm has a small weight and overhang with a wire angle close to 90 degree which is beneficial for wiring control
  8. Vertical feed employs a cast-in 4-rail mechanism to reduce TTV
  9. The wire-receiving system is located on both sides of the equipment and installed on an integral case base to keep stable
  10. The spindle adopts oil-gas lubrication and coolant is supplied by a separate water tank
  11. The base, spindle box, wire feeding and receiving support are all cast as unified