1. Process application: Silicon etching, polycrystalline silicon etching, silicon nitride etching, silicon oxide etching, silicon carbide etching, gallium nitride etching, gallium arsenide etching, aluminum nitride etching, optical waveguide etching
2. Wafer size: 8 inches and below
3. Applicable substrate material: Silicon, silicon carbide, gallium nitride, gallium arsenide, sapphire, quartz glass
4. Application area: Scientific research, Si based process, compounds (including GaN&GaAs&SiC&AlN, etc.), MEMS field, filter, optical communication, micro display, optical micro processing, etc.