تفاصيل أساسية
العدد (قطعة):1
الحد الأدنى للكمية المطلوبة:1
وقت التسليم:1~3 weeks
طريقة الشحن:快递, 空运, 陆运, 海运
وصف المنتج
Applications:
Mainly used for edge grinding of semiconductor wafers such as silicon, silicon carbide, gallium nitride, gallium arsenide, germanium, sapphire and ultra-thin liquid crystal glass.
Advantages:
1. Offers both metal bond and resin bond types
2. Can accurately match to meet the ultra-precision and ultra-high surface quality requirements