Suitable for semi-automatic wafer probing of 4-inch to 8-inch discrete devices, integrated circuits, and RF devices. The machine is specifically designed for the testing requirements of multi-die, multi-probe integrated circuits and high positioning accuracy, featuring high precision, high rigidity, and high stability. Automatic needle alignment improves alignment accuracy, facilitating multi-probe, multi-die testing needs. The enclosed machine design can provide a nitrogen environment or a low-temperature testing environment, equipped with functions for high-voltage arc prevention and high-temperature oxidation prevention.